Shenmao America has introduced a range of low-temperature solder (LTS) materials in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
The company says its (LTS) materials are specially engineered to reduce reflow temperatures, mitigating PCB and substrate deformation, saving energy, reducing thermal stability requirements of substrates and components, and ultimately enhancing yield rates.
One of the offerings in this lineup is the PF734-S low-temperature BGA solder sphere, designed for low-temperature ball attachment processes. This is complemented by the low-temperature no-clean flux SMF-80 and water-soluble flux SMF-WC63.
PF734-S, built upon an improved low-temperature alloy PF734, outperforms conventional low-temperature alloys like 42% Sn and 58% Bi. Its mechanical properties have been significantly enhanced, ensuring exceptional product reliability even under rigorous testing conditions such as thermal cycling and thermal shock tests.
The company’s low-temperature flux solutions, SMF-80 and SMF-WC63, deliver excellent workability and are formulated with special activators that optimize wettability and solderability. As a result, manufacturers can achieve superior ball attachment yield rates.
The no-clean flux SMF-80 eliminates the need for post-reflow cleaning while maintaining high reliability and insulation with minimal flux residue. On the other hand, the water-soluble flux SMF-WC63 offers outstanding cleanability, and any flux residue left after reflow can be easily cleaned with water, ensuring exceptional surface cleanliness.
Both SMF-80 and SMF-WC63 are halogen-free and fully comply with RoHS, RoHS 2.0, REACH, and other relevant environmental standards.
