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SEHO to unveil component placement control system for THT assemblies

Solutions for zero-defect production at Productronica 2023
SEHO to unveil component placement control system for THT assemblies

SEHO to unveil component placement control system for THT assemblies
The AssemblyCheck checks for the presence of the correct components, the correct orientation or polarity, component colours are recognized and compared Source: SEHO Systems

Manufacturer of complete solutions for soldering processes and automated production lines, SEHO Systems, will present its new AssemblyCheck, a a component placement control system specifically optimized for THT assemblies, for the first time at this year’s Productronica show. THT components are often assembled manually or semi-automatically, so the risk of errors is correspondingly high. The new system is integrated directly into the assembly workstation and provides immediate feedback whether the components are assembled correctly. Only then can the circuit board be released for further processing in a wave or selective soldering system. This eliminates possible errors, which leads to a significant increase in quality and yield.

The new platform checks for the presence of the correct components, the correct orientation or polarity, component colours are recognized and compared. Further inspection tasks include text verification (OCV), orientation and code reading. Circuit boards with a bad mark marking are automatically recognized and not checked.Short cycle times and an assembly size of up to 610 x 510 mm [24” x 20”] guarantee high system efficiency.

To reduce investment costs when there are several workstations, the AssemblyCheck can also be used inline. The combination with the THT-AOI system PowerVision offers maximum ROI: both systems are integrated in just one module that is installed in front of the soldering system.

At the assembly transport level, the new technology checks for correct component placement. Incorrectly assembled circuit boards can be automatically removed from the line, while defect-free assemblies are released for the further process. After the soldering process, the AOI carries out the solder joint inspection at the return conveyor level of the module.

Booth A4.578

Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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