Finetch´s new high-end machine, The Fineplacer matrix, can be configured either as a high-end rework system or as a high-precision assembly and bonding system. Whilst the rework configuration allows the entire repair sequence of desoldering, removal of residual solder, reballing, application of solder paste and resoldering in place to be reproduced, the micro-assembly configuration offers an enormous bandwidth of connection technologies. These include: bonding, adhesive bonding, thermal compression bonding, thermal/ultrasonic or micro-mechanical/optical assembly processes. The machine is designed so that very small functional units can be exchanged on site during servicing. The striking combination of high placement accuracy, together with an especially large working area, permits the handling of components of the order 0.125 x 0.125 mm up to 100 x 100 mm for printed circuit boards, 450 x 350 mm for substrates and up to 12 inches for wafers. In addition to the standard applications, the Fineplacer matrix proves its capability especially when handling mixed functional units (MEMS/MOEMS) or multi-chip modules.
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