To further increase users’ comfort and product performance, Zestron has fully redesigned its Vigon RC 101 spray bottle head. It is a water-based cleaning agent specifically recommended to remove all types of burned-in flux residues from reflow and wave solder equipment. Recently, the ergonomic features of the spray bottle trigger were enhanced to allow comfort while spraying extensively. The spray head allows for the regulation of spray pressure, which results in the reduction of necessary pumping. Furthermore, the wide angle nozzle feature permits a more economical and even quicker cleaning of large surfaces. A point to point spraying feature can also be selected for the effective removal of burned-in flux residues. This improved spray performance leads to a reduction of overall down time. The spray bottle head has no flash point and can be applied directly onto cold or warm oven surfaces. Successfully tested with eutectic as well as lead-free flux residues, this product is recommended by leading manufacturers of reflow and wave solder ovens.
EPP Europe 434
Share: