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Process control in selective soldering

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Process control in selective soldering

Process control in selective soldering
Seho’s selective soldering systems offer all in one: hightest flexibility, high soldering quality even with demanding assemblies and a modular concept that allows a graduated invest. The real-quantity flux monitoring system is a milestone in process control. This high precision flux control does not only monitor the function of the drop jet fluxer, but also the actual flux quantity which is applied to the board. The measured quantity is compared with a reference value learned earlier. In case the system detects a deviation, an error message is initiated. In addition, the software clearly indicates, which part of the printed circuit board has not been fluxed correctly. This ensures process reliability and constant process conditions without any influence on the cycle time. Using a coding system, the intelligent tool management automatically recognizes incoming boards and allocates them to the soldering unit which is equipped with the corresponding solder nozzle tool. A fiducial recognition function for automatic PCB alignment features highest process reliability. This software feature allows to register the PCB to be soldered optically and to compensate various types of misalignment such as offset, rotational error and linear shrinkage within the PCB. Wrongly placed PCBs are detected and will not be soldered. In addition, this software tool contains an error proof function which checks the loading of the correct soldering program and controls each board for precise positioning. Therefore, even possible operator faults can be recognized and compensated. The warpage compensation function automatically compensates product- or production-related warpage of the assemblies to be soldered. A high-precision laser measuring system recognizes board warpage.

Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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