Alpha Assembly Solutions, a leader in the production of electronic soldering and bonding materials, is introducing Alpha TrueHeight Preforms, a solder preform engineered with embedded spacer technology that can address all major applications requiring 75 µm bondline and above.
These preforms are engineered with simplicity in mind to allow ease of implementation and maximum soldering performance. The architecture of the design not only addresses the bondline thickness requirement, but also reduces the opportunity for voiding. The design minimizes areas where gases can be trapped, compared to other technologies, during the reflow process. They can be flux coated as well from a wide selection of fluxes.
“Engineers can be confident of achieving their design goals during manufacturing when using TrueHeight Preforms”, said Eric Poh, Regional Product Manager for Solder Preforms. “They have the advantage of flexible spacer positioning, so strategic locations can be chosen to ensure consistent bondline thickness”.
