Christian Enzmann GmbH has achieved a major milestone with the successful mass production start of its new Stripping, Etching and Stripping (SES)-line. The process-optimized SES-line by Occleppo allowed Enzmann to improve the required etching quality significantly. Enzmann will be able to achieve a track gap width of 100 µm in 70 µm base copper and only 50 µm in 18 µm base copper. Enzmann decided to invest in the tailor-made SES-line to accurately and economically implement fine structures on PCB internal layers as thin as 70 µm. Precision fine-pitch PCB technology lets designers meet the controlled-impedance routing demands of today. This investment is part of Enzmann‘s ability to support RF, medical, and other applications that require an accurately defined signal.
The decision to use the Italian wet processing equipment manufacturer Occleppo was based on their high precision capability combined with high production speed, demanded by customers. Etching is a key process at Enzmann: The company‘s product portfolio comprises one- and two-sided etchware and vertical interconnect access (VIA) PCBs. Enzmann reports a continuously increasing demand for production in fine line technology from all sectors of the company’s customer base. Here in particular, the Occleppo line has an excellent track record in producing PCBs with very fine copper track structures.
EPP Europe 518
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