Nordson March, a Nordson Company, a global leader in plasma processing technology, announces its new FlexTrak-CDS Plasma System, a high-volume, compact platform with strip processing capabilities. The system doubles the capacity and throughput of its predecessor, while consuming only 16% more floor area. The patented plasma chamber delivers a low cost of ownership, treating up to 10 strips per plasma cycle. The system is designed for plasma treatment prior to die attach, wire bond, mold encapsulation, and underfill. Plasma treatment removes contamination, etches surfaces to improve adhesion, and provides surface activation during electronics manufacturing. Surface activation by plasma treatment can enhance die attach, molding, wire bonding, and underfilling by enhancing fluid flow, eliminating voids, and increasing wicking speed. The plasma system’s integrated strip handling system delivers rapid and reliable material transfer for a wide range of strip sizes. Processing can be done from most types of magazines and carriers. The patented chamber design and control system enable short plasma cycle times with low overhead, ensuring that throughput is maximized and cost of ownership is minimized. The chamber technology of the CDS platform is exactly the same as the CD platform, so transition to the new CDS platform is easy. The system features a compact footprint of 1119mm wide x 1286mm deep (44 x 51 inches).
„The strip-handling ability of the FlexTrak-CDS System offers tremendous flexibility for several applications in backend semiconductor and electronics manufacturing,“ explained James Getty, president, Nordson March. „Our patented plasma technology in our popular FlexTRAK platform, combined with the ability to handle strip-type components, answers our customers‘ requests for this new capability in plasma treatment.“
Share:
