ViTechnology has announced the signature of a partnership with the Korean Company Synapse Imaging, specialized in 3D optical inspection. Synapse Imaging and Vi Technology will work in partnership to offer an industrial solution for 3D Solder Paste Inspection (3D SPI). Synapse Imaging will bring the technology, FAHP (Flying Absolute Height Profilometry), VI Technology will use its experience in AOI to promote develop and support business worldwide. The new system “Vi Technology 3D SPI by synapse” will be integrated into the Vi Technology Product range to offer a complete SMD line AOI solution from solder paste inspection (2D and 3D), pre-reflow inspection with close loop control to post-reflow inspection including latest enhancements such as Profiler. “This partnership seals a long term collaboration between both companies,” explained Jean-Yves Gomez, Vi Technology CEO, “with the goal of offering solutions for our customers which help them to improve their quality and productivity”. “The success of 3D SPI depends on,” said Jason Kim, Synapse Imaging CEO, “how exactly proving the relation between solder paste qualities and the final assembly defects. The synergy effect by this partnership will lead the growth of 3D SPI market through fully connecting the front-end process control to the back-end process control.” The 3D SPI tool, together with either pre- or post-reflow proven AOI solutions will allow users to better control their process, even for component such as BGA, mBGA or CSP without integrating solutions like X-ray which are limited in term of speed and efficiency. “Most of the defects, detected at the end of the line, are a combination of several factors at different stages of the process,” said Jean-Marc Peallat, Marketing Director. “Gathering all this data at the earliest possible stage in the line, will offer our customers significant benefits in yield improvement, process control and traceability.”
EPP Europe 416
Share:
