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Oxidation free process alternative to MSD and PCB baking

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Oxidation free process alternative to MSD and PCB baking

Oxidation free process alternative to MSD and PCB baking
Super Dry by Totech has introduced a new series of oxidation free drying and storage systems for moisture sensitive devices. Designed to exceed the formidable challenges associated with IPC J-STD-033B.1 for handling of Moisture Sensitive devices, the XSD Series desiccant cabinets offer a process combining low humidity and mild temperatures already proven to replace vacuum oven baking of taped on reel components at a fraction of the cost. They can also dry PCBs and other moisture sensitive devices at high speeds without the oxidation and inter-metallic growth induced by high temperature baking. And, unlike vacuum or baking ovens, the XSD cabinets also offer cost effective long term and short term MSD safe storage solutions in full compliance with 033B.1 specifications.

The XSD 1400 and XSD 700 series cabinets employ a unique, energy saving dual wall insulated steel and glass design and the U5002 „Dynamic Series“ closed loop Zeolite dryer. Featuring powerful dehumidification, optimal humidity levels are below 0.5 % RH and vapor content of less than 0.6g.m3. In addition, their design regenerates only when necessary according to cabinet load, thereby further reducing energy consumption, which averages less than 30W/hr. Oxidation has always been a significant drawback of baking components, and in fact even a single bake cycle at typical 125° temperatures will significantly increase wetting times. The Super Dry process reduces this oxidation risk, because it employs mild, low heat delivered within an exceptionally dry atmosphere. The oxygen molecules in water are a much greater catalyst to the oxidation process than those in the air. So heating at the sub 0.5 % RH levels the XSD is capable of achieving does not promote the oxidation common to traditional processes. And furthermore, 50 degrees C is safe for tapes and reels, enabling drying of taped component without damage. This fully eliminates the cost and logistics of removing components from tape prior to drying, then re-taping for subsequent production use.
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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2023
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