Heraeus Electronics, a supplier of material solutions for the semi-conductor and electronics industry, is expanding its range of no-clean solder pastes with a low melting point. The F498 product series allows significant cost savings in the soldering process.
This series is characterized by a low void rate and good wetting properties on a variety of surfaces. This reduces the formation of solder balls (mid-chip balling). The lower temperature in the reflow process also reduces energy consumption. Low-melting soldering pastes use up to 40 % less energy, resulting in a corresponding reduction in carbon emissions. Longer cleaning intervals due to the lower temperatures reduce maintenance costs.
There are also other advantages related to the lower temperatures for soldering processes. Until now, components and circuit boards were subjected to temperatures of about 250 °C, when using traditional lead-free soldering pastes. Soldering pastes with a low melting point allows the temperature to be reduced by around 70 to 80 °C. Components and circuit boards are subjected to less temperature stress allowing lower-cost components to be used. In addition, these soldering pastes can be used to mount components with lower temperature specifications, such as those from optoelectronics or the LED industry.
“Our products are used in sophisticated production environments, and our customers demand durable yet low-cost solutions. We have succeeded in this with our new no-clean solder pastes. These pastes reduce energy costs, contribute to lower carbon emissions and can be used in more applications,” states Stefan Merlau, Product Manager. “Heraeus Electronics is continually growing its product portfolio with the aim of providing materials for all specifications from a single supplier.”
