Kulicke & Soffa Industries, Inc. has introduced two wire bonders at Semicon China, in Shanghai. The first is the IConn PS high performance wire bonder, which will replace the current Maxumultra. The name IConn PS comes directly from its function of IC inter-Connect. According to the company it offers the highest performance in wire bond packaging assembly, with features including: +/- 2.0 µm accuracy for sub-35 µm ultra fine pitch requirements; advanced looping processes; automatic self-teaching bond integrity test system (Auto BITS) and programmable focus optics for complex stacked die packages.
The second bonder is the ConnX PS high speed wire bonder, which replaces the Maxumelite. The ConnX PS is engineered to provide unsurpassed throughput for manufacturing lower pin count ICs and LEDs, in the cost performance part of the assembly market. Its features include: +/- 3.0 µm accuracy; look ahead vision algorithms to align and bond simultaneously; as well as programmable red/blue illumination.
The PS superscript in both these wire bonders means they will be part of the company’s new power series product line. Reportedly this series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market. The power series will also be represented by a new product line symbol – a form of the Chinese character “Li”, which means power and strength throughout Asia. Common features for both bonders include: Larger 80 mm bondable area and advanced motion control system; dual frequency transducer and programmable power supply system.
EPP Europe 448
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