With more than 1,600 installations, Parmi, a world leader in 3 dimensional inspection of printed solder paste on PCBs, announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series. The system is a next-generation in-line solder paste inspection (SPI) system. The system hosts a number of features including measuring speed of 100cm2/sec and 10x10um resolution, innovative Dual Laser Beam technology, state-of-the-art closed-loop upstream and downstream processing with more than a dozen screen printer and placement machine suppliers. Additionally features include bare board mapping, exclusive and innovative real-time PCB warpage compensation, 100 percent material compatibility, inspection head with Z axis motion, user defined GUI, complete SPC package, 100 percent off-line programming, full bar code capability, remote monitoring and control and more.
The system inspects pads smaller than 01005 and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced by Parmi’s development of the RSC-6 sensor. Furthermore, the RSC sensor delivers 0.42 to 0.6x magnifications providing more control to the engineer.
The innovative laser measurement head uses a method called optical triangulation to measure the height, area and volume of each pad. The RSC6 laser sensor head uses two laser beams coming from opposite angles (dual laser) to completely eliminate the effect of shadows on the measurement data (zero shadow effect). This, combined with the developed Multiple Profile Correction technology; creates detailed and accurate color 3D images of every pad far surpassing its competitors.
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