Mirtec, inspection technology provider, unveiled two new systems to address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations in Munich. While the official launch of the ART system and TAL 3D SCAN is scheduled for May 2024, the company showcased these products at Productronica in November.
Solder joint inspection reinvented
The Anti-Reflection Technology (ART) system is equipped with five 15 Megapixel Cameras and four Digital Multi-Pattern Blue Moiré Projectors, providing unparalleled accuracy in solder joint inspection. Unlike traditional systems, the ART system uses multiple main cameras to capture 3D pattern images simultaneously, ensuring stability and precision even in challenging conditions like light saturation and shadow interference.
The technology brings a new level of reliability to solder joint inspection, eliminating noise from the 3D data and providing a clear, accurate representation of the solder joint‘s height and shape. The system‘s unique structure ensures there are no blind spots on the solder joint, offering a comprehensive inspection solution.
Elevating productivity for THT+SMT mixed PCB inspection
TAL 3D SCAN is a specialized 3D laser scanner attachment designed for precision inspection of tall components. Integrated into the PCB transport system, the attachment scans waiting PCBs on the first stage while the 3D AOI is in action on the second stage. This innovative approach reduces cycle time and increases productivity by loading inspection data from the 3D laser scanner during the inspection process.
TAL 3D SCAN has a height measurement range of up to 75mm, and provides a solution for THT+SMT mixed PCB inspection. The system achieves this without the need for Z-axis movement, ensuring inspection speed remains unaffected.
30% productivity improvement
TAL 3D SCAN not only addresses the height measurement challenges but also brings a significant productivity boost to THT+SMT mixed PCB inspection. With the ability to inspect taller components without slowing down the inspection time, TAL 3D SCAN offers a remarkable 30% improvement in productivity. This efficiency gain is particularly beneficial for PCBs with a high percentage of tall components.
