AIM Solder, a manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at productronica Germany 2017, scheduled to take place on November 14th-17th, 2017 at the Messe München.
The company will highlight its REL61 lead-free solder alloy at the show. This solder alloy addresses the most challenging issues with today’s common lead-free alloys, specifically soldering performance, cost and durability. A low silver/low cost alloy, it is not only more durable than SAC305, but has a wider process window than any low/no silver alloy on the market today. REL61 improves wave and selective soldering performance, addressing sluggish barrel fill issues common to other low/no silver alloys and eliminating costly alloy maintenance and analysis requirements. Extensive testing indicates that it can reduce tin whisker formation, as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance. Combined with the M8 solder paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity.
The company will also highlight the full line of advanced solder materials, including solder paste, liquid flux and solder alloys, along with its newly developed REL22 solder alloy for extremely harsh environments.
productronica, Booth A4.409
