Cyberoptics has showcased its SE500X advanced 100 percent 3-D solder paste inspection system, the newly developed ‘larger board’ version in the SE500 series at Productronica 2009. This system has the ability to inspect even the most demanding assemblies with >80 cm2/second inspection speed that does not compromise measurement accuracy and repeatability. The SE500 and larger board SE500X systems can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds. This gives the SE500 product line two models in the series to accommodate different board/panel sizes. The SE500 features a conveyor that can transport board/panels from 50 x 50 mm up to 510 x 510 mm, while the SE500X can accommodate 100 x 100 mm up to 810 x 610 mm.
EPP EUROPE 545
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