Koh Young, provider of 3D measurement-based inspection solutions, will offer live demonstrations of its inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica in Messe München on November 14–17, 2023, in Munich, Germany. The company will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Its sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. The company will be highlighting the following:
Solder Paste Inspection (SPI)
In 2002, the company introduced the concept of 3D measurement-based solder paste inspection. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. “The KY8030–3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market,” the company said. “With a patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process.”
KY8030–3 Industry’s Fastest True3D SPI Solution with Integrated Auto-Repair Dispenser
aSPIre3: Industry’s Highest Performing True3D SPI Solution
Automated Optical Inspection (AOI)
The 3D AOI Zenith delivers inspection performance with True3D measurement technology. “In the 2D inspection world, false calls and escapes are unavoidable. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. The Zenith measures all components in True3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.”
Zenith Alpha Best Value True3D Automated Optical Inspection Solution
Zenith UHS Industry’s Fastest True3D AOI Solution
Zenith 2 UHS Introducing the industry‘s most groundbreaking 25 MP True3D AOI Solution
Zenith S Standalone, high-performance 3D AOI System
Automated Pin Inspection (API)
“Built on its True3D AOI technology, new enhancements help it break through barriers associated with inspecting products with a mix of both Pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press-fit, and Final Optical Inspection, as well as for pins inside a connector shroud, while also inspecting traditional SMDs on the same product. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed.”
KY-P3 Industry-awarded breakthrough in 3D Automated Pin Inspection
Dispense Process Inspection (DPI)
The Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using the company‘s LIFT technology (Laser Interferometry for Fluid Tomography), the system delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.
Neptune C+ Award-winning True3D In-Line Dispensing Process Inspection (DPI) Solution
Process Control & Optimization Software
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes. Koh Young can help manufacturers solve significant business challenges by applying connectivity to modernize industry processes. By leveraging IPC-CFX with its AI-powered technologies, Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge.
KSMART Seamless Smart Factory Software Suite Turning Data into Insights
KPO Award-winning AI-powered Printer and mounter Process Optimization Software
Semiconductor and Advanced Packaging Inspection
The Meister Series delivers True 3D measurement-based inspection for ultra-thin solder, wafer bumps, balls, and components. Manufacturers can maximize yield without increasing costs by detecting defects at the wafer level with accurate inspection.
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Meister D+ Breakthrough in 3D Measurement for Highly Reflective and Mirror-surfaced Components
Meister D Industry’s Leading Inspection Systems for Advanced Packaging
Booth A2.377 & A2.359
