KIC, provider of thermal process and temperature measurement solutions for electronics manufacturing, is participating at the upcoming SMTconnect exhibition, taking place 11-13 June 2024 in Nuremberg, Germany at Stand 4A.225. The company will showcase its latest Contact-less Thermal Analysis technology which enables real-time monitoring of temperature and convection changes by directly measuring board temperatures during production. With the new technology, manufacturers can achieve unmatched accuracy in reflow profiles, ensuring optimal quality and reliability in the production process.
Moreover, the company will introduce its new profiling software platform, the Thermal Analysis System, featuring the addition of a recipe optimization search mode called Common Recipe Finder. The company says the Thermal Analysis System offers a state-of-the-art User Interface, providing flexibility in reflow and wave recipe setup with a user experience akin to browsing. Common Recipe Finder simplifies changeover time by identifying a single recipe for multiple assemblies, thereby enhancing equipment utilization and Overall Equipment Effectiveness (OEE).
“We are excited to unveil our latest innovations at SMTconnect 2024,“ said Miles Moreau, General Manager at KIC. “With Contact-less Thermal Analysis™ and Common Recipe Finder™, we continue to push the boundaries of thermal process control, empowering manufacturers to achieve unprecedented levels of precision and efficiency in their production processes.“
