Manufacture of capital equipment used in in PCB assembly and semiconductor industries ITW EAE will showcase its latest developments at Productronica, November 14–17 in Munich, Germany. The ITW EAE booth will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
MPM will be presenting live demonstrations of the Edison II ACT (Automated Changeover Technology). This technology provides a simple, cost-effective solution for factory automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer with an automated changeover of the solder paste cartridges, support tooling, squeegees, and stencils.
Camalot will be demonstrating its Advanced Tilt and Rotate option on the Prodigy dispensing system. This feature reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.
Electrovert will feature the new Heavy-Duty Conveyor. The Heavy-Duty Finger Conveyor option being introduced by Electrovert is designed to address the increasing demands of PCB production in terms of throughput capability and process flexibility. Electrovert will also feature the patented Auto Exit Wing which provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing.
Vitronics Soltec will feature ZEVA Selective Soldering solutions with the patented Bridge Prevention Technology acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed. This design is only feasible with the design freedom of 3D metal printing technology. The company will also showcase the new Centurion+ Reflow Oven. The Centurion+ is a robust upgrade to the Centurion designed for heavy solder paste users with unique features that further minimize maintenance and keep the process chamber cleaner.
ITW EAE will also share advancements made on interface solutions for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
Booth A4.554
