In regards of quality Fuji sets a new benchmark with the new inspection head IH, which can be used with all NXT-II modules already installed. In addition it is now possible to completely control the placing pressure. All parameters are considered in order to guarantee a constant placement force, such as height tolerance of components or the PCB warpage. For NXT Fuji also introduces new placement heads. The so called H08M placing head combines the speed of a chipshooter with the flexibility of a finepitch head. Furthermore Fuji announces a new finepitch intermediate head. The new H04S placing head boosts the placement of components with a size of up to 38 x 38 mm. Last but not least, the new developed Multi Wafer Unit, which is attached on to the standard NXT platform, makes it possible to manage the mixture of SMD components and die applications in one line.
EPP EUROPE 539
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