Good news for the LDS technology: the engineers and technicians have further optimized the top model for laser direct structuring, the LPKF Fusion3D. With a few targeted steps the company was able to again noticeably reduce structuring times for three-dimensional circuit boards: head of the business division, Nils Heininger, alludes to a performance increase of 10 to 20 percent depending on the component layout.
The increased speed is the result of dramatically revised optics and laser control. “Highly dynamic components and optimized algorithms are resulting in shortened processing times and reduced unit costs”, Heininger comments. He emphasizes the aptness for a high level of product variability. In april this laser system gained the prestigiuos Hermes Award 2010.
Since last year the company is excited about an increased demand even from smaller producers. Making it therefore all the more welcome that the laser head costs could be reduced: higher performance for less money.
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