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Henkel launches high thermal die attach paste for power package applications

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Henkel launches high thermal die attach paste for power package applications

PR_343_--_wirebond-die-attach-semi-sintering_(1).jpg
Henkel says the high thermal die attach paste has been developed for use in applications where no die back-side metallization (BSM) is required Source: Henkel

Henkel has announced the launch of a high thermal die attach paste, called Loctite Ablestik ABP 8068TD, developed for use in applications where no die back-side metallization (BSM) is required. The adaptability of the material gives semiconductor companies a high thermal conductivity die attach option for bare silicon (Si) die integration and is particularly well-suited for high power applications, the company said.

“This material allows packaging specialists to satisfy the requirement for high heat dissipation in applications where bare silicon die are used, particularly in situations where back-side metallization processes are cost- or process-prohibitive,” Henkel’s Semiconductor Packaging Market Strategy Manager, Raj Peddi, explained. “Because the material is compatible with different die – whether metallized or not – it provides more design and manufacturing opportunities for OSATs and power device developers.”

 The new die attach paste extends the benefits of semi-sintering to a wider variety of power packages using different types of die and lead frame finishes. The material has bulk thermal conductivity of 50 W/m-K and was evaluated across several standard testing regimens with bare Si die and Ag-metallized die of various dimensions, up to 5.0 mm x 5.0 mm; as well as on copper (Cu), Ag and pre-plated (PPF) lead frame finishes. 

 “Already proven in volume production, Loctite Ablestik ABP 8068TD delivers another high-thermal, package-level solution for devices integrating bare Si and/or metallized die, including QFNs, SOTs, and LGAs, among others,” Peddi added. “This is an important development for the power package sector.”

www.henkel.com

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