Indium Corporation introduced Indium10.5HF, a halogen-free, Pb-free solder paste at the IPC Apex Expo in San Diego, California. The solution is a no-clean solder paste designed to improve ICT first-pass yields. It is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry. The solder paste has a soft, pliable, non-tacky residue that minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields. It offers unprecedented stencil print transfer efficiency, making this solder paste suitable in the broadest range of processes. It also provides excellent head-in-pillow performance. The solder paste saves time and increases output for companies that require ICT as part of their normal production.
“This solder paste is ideal for customers in a wide range of markets, including automotive, medical, computing, communications, and aerospace/military,” Glen Thomas, product manager, PCB solder paste said. “Additionally, many of our customers have reported improved wetting and solderability for their applications, especially for RF shield-attach.”
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