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Garner Osborne buys x-ray inspection system from Altus

Inspection equipment
Garner Osborne buys x-ray inspection system from Altus

Garner Osborne has purchased a Scienscope x-ray inspection system from Altus Source: Altus

UK supplier of electronic production equipment Altus has announced that Garner Osborne, a specialist in PCB design, manufacture and assembly has purchased a Scienscope X-Spection 6000 X-Ray Inspection system for their factory in Berkshire, UK. According to Altus, the system is the most technologically advanced x-ray inspection system, and includes every advanced software tool required for a wide variety of applications.

“Our team are always striving to offer customers the very best production capabilities on the market and part of that is delivering the highest quality products we can. With this investment we take another step in enhancing our offering to our customers with a great piece of equipment that adds quantifiable analysis to our X-ray process. We are looking forward to getting it onsite and pleased that it will be supported by the Altus team moving forward,” Steve Honeybun, director at Garner Osborne explained.

“It’s been really enjoyable working with Steve and his team to evaluate a new X-ray in their approach to process improvement projects. This is exactly how we like to work,” Joe Booth Altus CEO added.

“We couldn’t be happier that Altus and Scienscope have been selected and it is reflective of Garner Osborne’s status and future ambitions, that they have invested in the flagship X-Spection 6000 unit. This investment will add some significant value to their existing and prospective customers in driving up quality. We are pleased to be adding to our partnership so far.”

Standard features of the system include fully integrated, 130 kV high power closed X-ray tube, 60° camera tilt for oblique angle viewing, 22″ x 18″ inspection stage with 350° rotation, colour mapping camera with zoom window provides easy location and identification of fault, Altus said.

The system can work for many applications including multilayer PCBs, BGA-micro BGA flip chip inspection, semiconductors and encapsulated components. Using highly-advanced software, the system has BGA void detection and automatic calculations with easy macro reading for intuitive step and repeat programming. It has been designed to provide all the tools needed to complete inspection successfully and increase product quality.


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