CyberOptics’ innovative QX500 AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM), bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false failure rate. The introduction of strobed white lighting in the AOI makes it the only system to provide ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec. The system’s dual fixed angle lighting provides superb image quality for advanced automated inspection of solder and lead defects, presence and position, correct part, and polarity for inspection down to 01005 components.
The 100 percent 3D solder paste inspection system (SPI) SE350 is equipped with the com-pany’s calibration-free 3D sensor technology to inspect even the most demanding assemblies at 80 cm²/second inspection speeds without compromising measurement accuracy and repeatability. The sensor is an integrated assembly designed with no moving parts, eliminating machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry.
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