Ventec International, a producer of polyimide & high reliability epoxy laminates and prepregs, will display its latest PCB materials innovations at IPC APEX 2017 at booth #3715, including the industry’s most advanced ultra-low Dk PCB materials for high-speed low-loss applications. The show will take place from the 14th to 16th of February 2017 in San Diego, USA.
The company’s team of materials experts will present the next generation polyimide technology including the ultra-low Dk PCB materials for high-speed low-loss applications. Further, show-highlights will feature advances in high performance IMS materials that deliver an exceptional thermal performance, reliability, and quality which was particularly demanded by automotive and other LED lighting and DC power conversion applications. Visitors to the booth will also be introduced to the company’s complementary ranges of PCB base-materials including products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils and coatings.
Jack Patty, President of the US operation, commented: „Our continued global strategic investments in human resources, new technologies and production equipment that expand our product offerings and leverage production resources enable our customers to enjoy one single access point to an extraordinary portfolio of complementary products & services today. We offer a one-stop-shop-solution, all supported by our global network of manufacturing & service centers linked by a fully owned and controlled global supply chain that ensures product quality, consistency, and reliability.“
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