ECD has announced that its M.O.L.E. EV6 thermal profiler will be shown live in Europe for the first time during the upcoming SMTconnect 2023 event in Nuremberg, Germany. As the market’s only traveling thermal profiler with full colour touchscreen
control, the profiler frees personnel from the PC, as profile data can be viewed directly on the device. This time-saving solution complements ECD’s OvenSENTINEL reflow monitoring system, which will also be demonstrated at SMTconnect in Hall 4, Stand 317.
As electronics manufacturers look to improve productivity and automate process insight, OvenSENTINEL has seen a doubling of installations year-on-year. When paired, M.O.L.E. EV6 and OvenSENTINEL deliver an unparalleled solution to setting, maintaining, and verifying reflow process parameters for advanced PCB assemblies.
“M.O.L.E. EV6 marks the most significant development in thermal profiler technology in ten years,” explains Mike Hayward, ECD EMEA Director of Operations. “Touchscreen control is long overdue in the profiling arena, and we are proud to be the first to bring it to market. Now, users can view and interact with process calculation templates, view profiles, and see pass/fail analysis in the palm of their hand. This simplifies the profiling process, raises productivity, reduces errors, and allows on-the-fly decision-making. Likewise, OvenSENTINEL offers dynamic and customizable real-time monitoring of the reflow process, taking the burden off operators while delivering deep data-supported product traceability – all in an open communications protocol.”
The feature sets of both systems include:
M.O.L.E. EV6
- Instrument status display with live temperature readings
- USB-C communications and charging
- Wireless capability via Bluetooth
- Compatible with multiple thermocouple types
- No PC downloads required; all data displayed on-screen, on the device
- Built-in calibration reminders for maintenance simplicity
- Seamlessly integrates with all RIDER verification tools: OvenRIDER, WaveRIDER, and SelectiveRIDER for a complete, multi-process, soldering machine verification system
OvenSENTINEL
- Dynamic measurement capabilities with customizable data extractions and sensor types
- Open architecture, Industry 4.0-enabling
- Interface supports multiple lanes, ovens, and factories
- Profile SnapShot one-button, on-demand profile confirmation of oven readiness and KPI alignment
- TrueProfile™ trusted traceability technology
Hall 4, Stand 317
