Expert in thermal monitoring and analysis technology, ECD, will display and demonstrate its award-winning line of soldering process tools at the Productronica 2021 trade show in Munich from 16–19 November. The company, which will be located in Hall A4, Booth 120 says the trade show marks one of the first live events for ECD in more than a year. “Productronica represents a unique opportunity to debut – in person – several technologies that have been conceived, developed and refined in recent months, as well as the company’s flagship products.”
The company says highlights of the display include its OvenSENTINEL continuous monitoring software and its brand new SelectiveRIDER verification pallet, both of which will be available for show delegates to experience first-hand. Process optimization across soldering disciplines is enabled by the company’s standard-setting M.O.L.E. in-transit thermal profiling device, which interfaces with all soldering process measurement pallets for a holistic approach and future-proofing confidence.
For reflow soldering process control, the OvenSENTINEL TrueProfile capability allows extended measures to provide a more thorough and customizable traceability record. With an expansive sensor network, measurements of far more than temperature and conveyor speed deliver a robust data set with hundreds of calculations available, all supported through integration with ECD’s M.O.L.E. MAP software. The company says the recently added Profile Snapshot which allows on-demand profile viewing and data generation, makes OvenSENTINEL an even more powerful yield-enhancing, cost-saving system. Along with the M.O.L.E. thermal profiler, tools such as OvenRIDER and tough thermal barriers, it closes the loop on reflow soldering process control.
Debuted in late 2020, SelectiveRIDER will also be shown at an international event for the first time at Productronica. Enabling validation of the three phases of selective soldering (fluxing, pre-heating and soldering), SelectiveRIDER provides third-party, independent verification and confirmation of selective soldering process parameters. With this development, ECD’s portfolio of process measurement pallets now covers the entire spectrum and enables validation of every machine soldering process. What’s more, a single M.O.L.E. thermal profiling device will work with all three pallets for an integrated and flexible solution.
While these soldering process technologies form the heart of ECD’s exhibit, the company has also pioneered numerous other innovations such as SmartDRY Intelligent Dry Storage systems, simple and effective flux optimization tools, and a complete line of solder process accessories. Throughout the event, ECD technologists will be available for process and product consultation.
Hall A4, Booth 120
