CyberOptics Corporation, global developer and manufacturer of high-precision 3D sensing technology solutions, has announced it will unveil its new dual-mode MRS sensor for its SE3000 SPI system at Booth #2541 at the IPC Apex Expo 2022, taking place at the San Diego Convention Center in California from 25–27 January. In addition, it will demonstrate its SQ3000 Multi-Function system for AOI, SPI and CMM and feature the new SQ3000+ Multi-Function system for advanced applications.
According to the company, its new Dual-Mode MRS sensor provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed inspection and another mode for high-resolution inspection. “The new sensor is an extension of the proprietary Multi-Reflection Suppession sensor portfolio that provides industry-leading performance in semiconductor and SMT markets,” CyberOptics said. “The SE3000 is ideal for measuring height, area, volume, registration and bridging, as well as detecting insufficient paste, excess height, smear, offset and more.”
“We designed the Dual-Mode MRS sensor specifically for our SE3000 system to provide both superior performance and versatility for SPI,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We’re providing yet another solution that can significantly improve our customers’ yields, processes and productivity.”
At APEX, the company will also feature the SQ3000+ Multi-Function system for inspection and metrology, an extension of the SQ3000 platform, that not only conducts AOI and SPI, but delivers in-line, full coordinate measurement (CMM) data in seconds. The company says “the all-in-one system offers a combination of unmatched high accuracy and high speed, with an even higher resolution MRS sensor that inhibits reflection-based distortions caused by shiny components and surfaces.”
“The SQ3000+ is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT for medical, military, aerospace and advanced electronics, 008004/0201 SPI, socket metrology and other challenging CMM applications.”
