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Compact high-speed modular surface mounter

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Compact high-speed modular surface mounter

Compact high-speed modular surface mounter
YSM10 Compact High-speed Modular Surface Mounter. Source: Yamaha Motor Europe IM
Yamaha Motor Europe IM announces the launch of its YSM10, a surface mounter that is the world‘s fastest in its class at 46,000 CPH. This new addition to the line-up is a compact, high-speed model with space-saving qualities, and provides a combination of component compatibility and versatility.
In addition to the high-end ultra-high-speed modular Z:TA-R YSM40R, and the upper-middle class all-round versatile high-efficiency modular Z:LEX YSM20, this new release enables the YSM series line-up to provide a range of optimum lines designed for a variety of production formats and scale sizes.
The YSM10 is newly developed based on the three „Ones“ concept and provides 1) a combination of a mounting speed that is number one in its class, 2) a one-head-solution that does not require replacement, and 3) an integration of three models of the YS12 type into one platform.
While in pursuit of the ideal concept – a 1-head solution with versatility from small chips to large components, the world‘s fastest speed in its class, and without the need for head replacement – the new model also has a high-speed general-purpose head similar to that used in the Z:LEX YSM20, and a new generation servo system etc. creating a high-class model with the latest technology.
Simultaneously, the specifications of all three current models of the YS12 series have been integrated into one platform featuring the flexibility and mobility of the compact high-speed modular YS12; the partly simplified version of the compact economy-modular YS12P, and the highly-versatile compact modular YS12F.
In addition, pickup and recognition errors are suppressed along with reduced loss in machine stoppage due the integration of the common functionalities of the two high level machines, the Z:TA-R YSM40R and the Z:LEX YSM20 with their e-Vision for automatically creating and tracking component data, Smart Recognition for easily creating component data from complicated shapes, and Pickup MACS system for automatic correction of the component pickup position.
SMT Hybrid Packaging, booth 4-321
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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