IPC Association Connecting Electronics Industries and SMTA (Surface Mount Technology Association) will host a cleaning and coating symposium on High Performance Electronics Assembly Cleaning on October 28 th to 29 th, 2008, in Rosemont, Illinois. The symposium will focus on all classes of high-reliability and high-performance electronics assembly and will include case studies from manufacturing experts in aerospace and defense, automotive, consumer, telecommunications, and medical products industries.
Symposium committee chair Dr. Mike Bixenman, chief technology officer, Kyzen Corporation, says, “Technical portions of the symposium will include cleaning and coating trends, challenges, new technologies, process integration, process qualification, and reliability concerns. Attendees – from engineers, suppliers and managers to executives from all segments of the electronic interconnection industry – will leave well-versed in all aspects of cleaning and coating.”
The two-day symposium will be composed of five sessions and three panel discussions. The five sessions will cover standards and regulations, cleanliness assessment, building Class 2 and 3 assemblies, lead-free cleaning and conformal coatings. During the panel discussions, attendees will share ideas on topics such as cleaning machines, cleaning process integration and electronic cleaning fluid designs. For more information about the symposium or to register, visit www.ipc.org/CleaningConferenceBrochure or contact Michelle Michelotti, IPC professional development coordinator, at +1 847–597–2822 or MichelleMichelotti@ipc.org.
EPP Europe 452
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