The Balver Zinn Group and Cobar Europe BV will showcase a complete range of advanced solders and soldering materials at the upcoming SMT Nuremberg show, scheduled to take place June 8–10, 2010. Balver Zinn will feature the i-SAC series of optimized alloyed SnAg solders. With the addition of Cobalt (Co), the solidification characteristic of silver containing alloys has been improved to offer an optimised lead-free solder solution. Cobalt produces shiny solder joints with a fine grain microstructure, in comparison to standard SnAg-alloys. The i-SAC 387 Solder contains Cobalt and is also formulated with Germanium (Ge), which plays the role of antioxidant and reduces the oxidation of the alloy in order to minimize dross formation. The solder has a melting temperature of 217 °C and a specific gravity of 7.5 g/cm³. The i-SAC Solder Family includes Tin Silver based i-SAC 105, with silver composition on request between 0.5 – 1.5 %. Offering the advantages of silver free alloys and the characteristics of silver containing alloys, i-SAC 105 produces affordable, bright and shiny solder joints and a fine grain microstructure, even with the low addition of silver content. Cobalt is also responsible for a homogenous microstructure in comparison to standard SnAg alloys. i-SAC105 has a melting range of 217 °C to 227 °C and a specific gravity of 7.4 g/ cm³. Also SN100CS solder will presented, the newest variant of the world-renowned SN100C. Due to its germanium (Ge) content of 100 ppm (0.01 %) SN100CS is ideally suited for minimizing dross formation in ambient soldering processes without the use of nitrogen. In the Balver Zinn SN100C formulation, Ge plays the vital role of antioxidant and reduces the oxidation of the alloy in order to minimize dross formation. Depending on the type of machine being used, a dross reduction of up to 40 % can be achieved. Positive side effects of increasing the Ge content include higher creep strength, better thermal conductivity and improved wetting properties. The company recommends using Solder SN100CS for both the first fill and the refill alloy. The lower surface tension has a positive influence on the flow rate of the solder. The SN100C series also makes it easier to maintain the composition of the solder bath within specification, due to the lower level of copper leaching. Cobar Europe BV will highlight new environmentally friendly fluxes, featuring a low-VOC flux, Cobar 95-DRX. This flux is based on a water/solvent combination and offers improved soldering performance, as well as wicking characteristics that approach a solvent-based system, resulting in a perfect soldering performance. Fulfilling the need for more environmental-friendly materials, they will introduce a new VOC-free flux, Cobar 396-DRX, at the SMT show. The new odorless flux is RoHS-compliant and maintains excellent soldering performance. Both halide- and halogen-free, Cobar 396-DRX is based on a water carrying system that provides advantages in transportation and storage conditions, and eliminates fire risks. According to IPC-J-STD-004, the Cobar 396-DRX and Cobar 95-DRX are classified as ORL0. In addition to these fluxes, new stronger versions called Cobar 396-DRX-M and Cobar 95-DRX-M are now available. These fluxes are classified ORM0 and provide excellent soldering performance in the toughest applications, leaving no visible residues. The company will also introduce its new Aquasol Branded Water Soluble Solder Paste, which can be used with any commonly used soldering alloy. SnPb and lead-free versions are available, all exhibiting excellent performance in the four key process steps: printing (including fine-pitch capability), placement, reflow and cleaning. Due to a perfect balance between adhesive and cohesive forces, there is efficient separation from the squeegee and good aperture release with long stencil life. With Aquasol Branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. The rosinous nature of this water-soluble paste is unique, with paste rheology, solder ability and water wash ability conferred by carefully selected surface chemistry and activators. Furthermore, the paste features excellent slump resistance and residues can be removed with de-ionized water. Voiding is also minimized in both air and nitrogen processes.
SMT/Hybrid/Packaging
Booth 9-340
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