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4-in-1 automated optical inspection solution for PCB production

Pattern inspection, laser via inspection, RMIV, and 2D metrology
4-in-1 automated optical inspection solution for PCB production

4-in-1 automated optical inspection solution for PCB production
The Ultra Dimension Automated Optical Inspection (AOI) series has four separate solutions in one machine that increases quality and yield. Source: Orbotech Ltd

Orbotech Ltd., a supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, introduced the Ultra Dimension Automated Optical Inspection (AOI) series for PCB production. Designed to meet the rigorous demands of advanced PCB manufacturing processes, this is the first Automated Optical Inspection solution to integrate four solutions – pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology – into a single system. This solution enables manufacturers to increase quality and yield, as well as reduce their overall total cost of ownership (TCO), signifying a revolution in the AOI room workflow.

The solution’s combination of high precision and high quality pattern inspection, as well as, laser via (LV) inspection in a single scan is powered by the company’s Triple Vision Technology and Magic Technology. By using varied light settings and three different types of images, not only is detection capabilities significantly improved, but there is also a reduction in inspection set-up time and false alarms. This, in turn, allows manufacturers of advanced PCBs using SLP/mSAP (substrate-like PCB/modified semi-additive process) the flexibility to inspect a variety of applications and materials, and eliminates the need to use inspection masks, which can cause defects to be overlooked.

The 2D metrology automatically measures both top and bottom conductor widths for lines and pads of a wide variety of shapes, enabling the higher accuracy and impedance control necessary for SLP/mSAP, as well as advanced HDI applications. The Remote Multi-Image Verification (RMIV) enables the remote verification of multiple image defects, which are acquired during the inspection process. The company’s unique multi-image technology enables operators to differentiate between real and false defects, which are then sent to offline RMIV stations. Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up valuable floor space in the Automated Optical Inspection room and allowing manufacturers to cut their overall labor and operational costs significantly.

www.orbotech.com

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2024
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