Alpha Assembly Solutions, a producer of electronic soldering and bonding materials, has recently released low temperature and void reduction assembly process technology solutions. This includes a new generation low temperature solder paste, OM-550, and a void reduction AccuFlux technology for solder preforms.
“OM-550 provides another low temperature solution to customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy,” said Robert Wallace, Regional Marketing Manager for the Americas. “We feel this paste provides customers with efficiencies in both energy and cost, while improving BGA mechanical reliability compared to other low temp alloys.“
“Alpha has developed an innovative void reduction technology.” said Jerry Sidone, Product Manager for Engineered Materials. “The latest AccuFlux technology for preforms has been specially designed to dramatically decrease voiding under bottom termination components, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge. Our paper, Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms, presents the results of a study that Alpha and our partners recently conducted to examine the impact of this preform technology on voiding under QFNs, QFPs and DPAK packages.”
The company has written 8 papers, two of which focus on low temperature technology and three addressing void reduction:
- Void reduction strategy for bottom termination components (BTC) using special flux coated preforms
- Novel mid-temperature alloy for enabling solder processing temperature hierarchy in SMT assembly
- High performance electronic interconnect materials characterization – techniques & challenges
- Low temperature soldering using Sn-Bi alloys
- A comparison of localized electronics cleanliness testing and surface insulation resistance
- Effect of voids on thermo-mechanical reliability of solder joints
- Process, design, and material factors for voiding control for thermally demanding applications
- Low-temperature solder paste process advantages
