Datacon has added Laurier’s ultra high precision flip chip die bonder to its portfolio. Designed to meet the needs of high accuracy bonding applications and specifically those of the optoelectronics and semiconductor industries, the M9 delivers sub micron resolution (0.5 micron placement accuracy). The M9 will prove to be a popular choice for universities and other research establishments, as the M9 chip die bonder is flexible and comes in a manual option which keeps the cost low. It is also very easy to use so that with as little as a day’s training, a student or technician can operate the basic system. Its small foot print means that it takes up very little clean room space. Other features of the M9 include handling forces of up to 200 kg, temperatures of up to 500 Degrees Celsius, Split Optics System and Brightfield/Darkfield Illumination. Additional to that there are Air Bearing Components, Tip/Tilt adjustment, Closed Loop Feedback Temperature and Force Maintenance, Motorized Stages, Windows XP. Typical application areas include optoelectronics (transmitters, receivers, MEMS, pump lasers, detectors) and semiconductors, low force focal plane arrays, LCD displays, automotive, RF devices and biomedical applications.
EPP EUROPE 425
Share:
