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Universal X-ray and CT inspection system

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Universal X-ray and CT inspection system

Universal X-ray and CT inspection system
With its X8060 NDT universal X-ray and CT inspection system, Viscom AG offers a non-destructive testing (NDT) solution for larger and heavier objects. Because computed tomography (CT) was integrated into the system design from the start, the system has an inherent flexibility that makes it a valuable inspection instrument for a wide range of industrial sectors, including automotive, aviation and aerospace, medical technology, turbine construction, machine tool manufacturing, materials science, ceramic and synthetics production, electronics, sensor technology and bonding technology. The system’s integrated computed tomography allows 3-D reconstruction of test objects weighing up to 30 kg (66 lbs). For objects of this size, the company has developed a micro-focus X-ray tube with a maximum acceleration voltage of 250 kV, allowing better irradiation of thick and highly absorbent structures. The company’s XMC real-time image processing provides improved images with no time delay, so the operator can fully concentrate on the inspection object without distractions.

Typical defects recognized by this non-destructive process are cracks, fractures, pores, voids, foreign bodies, form deviations, incorrect positioning, misalignment or inhomogeneous material transitions. The system’s capability to inspect hidden solder joints in electronics assemblies (such as with BGAs, THDs, etc.) using high magnification and angled radiation, which allows the three-dimensional structure of the solder joints to be directly viewed and evaluated, is reportedly unique in this class of system. Its versatility makes it especially attractive to the increasing number of manufacturers who incorporate electronics into larger modules and devices.
The system’s modular precision manipulator, with up to eight CNC-capable axes, opens up new possibilities for angled irradiation with high magnification by allowing measurement in all three spatial directions, either as a two-dimensional projection or a three-dimensional volume model. High-speed processors quickly bring a realistic image of the test object to the monitor screen, where it can be sliced in any direction and analyzed.
EPP Europe 455
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2024
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