The MUST System 3, manufactured by Gen3 Systems, measures the solderability of a printed circuit board and/or component’s metallic terminations by documenting the wetting curve of the unit under test. Using a small solder bath or solder globule and vertical force measurements, the system tests the solderability of lead-free and leaded PCB lands and component leads. Tests performed are defined by the following Standards bodies: IPC, IEC, MIL-STD, EIA and others. The system is appropriate for testing all devices including multi-leaded components, as well as SMT and BGA devices. Ascentech, North American Distributor for Gen3 Systems products, will provide sales as well as after-sales service and support.
EPP Europe 436
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