The Juki 300 is part of a line of selective soldering systems designed to meet the demands of a rapidly changing electronics manufacturing industry. The system is compatible with both lead and lead-free alloys, and offers reliability and industry-leading service and support features. The unit is a complete, high-level package ready for lead-free production. It comes fully equipped with all of the functionality necessary to begin production immediately. The system includes a soldering unit with nitrogen inertion at the mini-wave. Nitrogen inertion limits dross build up, opening the process window and reducing maintenance. An innovative nitrogen management system is used to reduce nitrogen consumption. Other standard features include: a micro-dot drop jet fluxer, a pressurized flux tank that supplies flux consistently to the spray heads, a convection pre-heater for flux activation, an exchangeable quick exchange mini-wave nozzle from 4 mm to 30 mm in diameter (custom nozzles are available by request), an auto feeder solder roll device, programming software that can accept images such as JPG, BMP, TIF, as well as Gerber files for easy programming, a float sensor for keeping constant levels of solder in the pot at all times, and a lead-free exchangeable solder pot with 25 kg capacity.
EPP Europe 425
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