The resin test from Zestron visually identifies the local distribution of resin-based residues on electronic assemblies via a color reaction. According to J-Standard 001 D for electronic assemblies class 3, only a resin content of 40 µg/cm2 is allowed (equivalent to the amount of resin residues on one solder joint). These resin residues can cause poor adhesion of conformal coatings as well as delamination effects. The test is available as a complete solution in a case, so that it can be used for on-site sampling inspection during SMT-production. By combining the resin test and the captive flux test (detects activator residues), a simple analytical package is available, which offers the possibility to quickly analyze all coating-relevant residues on assemblies.
SMT, hall 7, booth 210/ Nepcon UK, D44
EPP Europe 448
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