Seica has announced the release of a powerful new software release for the Firefly, its laser-based selective soldering system. The package includes a completely new automatic program development environment, which drastically reduces soldering program development time. Improved algorithms and faster loop control enable automatic management of PCB characteristics and environmental factors, resulting in higher soldering stability and quality. The precise X-Y-Z control of the laser head, born from the company’s long experience in developing Flying Probe test systems, make for high positioning precision and enables the system to rotate up to 180 degrees around the pin during soldering. Fiducial mark recognition and warpage compensation of the board are also standard features of the Firefly.
EPP Europe 422
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