CyberOptics Corporation will display its Flex Ultra automated optical inspection system (AOI), and SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system in booth 2D21 at the upcoming Nepcon South China exhibition and conference, scheduled to take place August 29 through September 1, 2006.
The Flex Ultra AOI system is an automated inspection solution for all stages of the SMT production process. Combining patented Statistical Appearance Modeling (SAM) technology with a simple user-interface, the Flex Ultra has a single programming paradigm that enables fast programming of AOI inspection tasks and the industry’s lowest false call rate. The system also features highly accurate and repeatable component offset measurement capabilities for process characterization and optimization.
During 2006, new features have been added to the inspection system, including technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.
SE 300 Ultra provides accurate, repeatable results at speeds that keep up with increasing line cycle times. The SE 300 Ultra incorporates the field-proven technology and reliable features of the SE 300 along with new features.
New features on the Flex Ultra include updated platform with enhanced resolution and faster inspection speeds, technology-leading 01005 measurement capability (component offset measurement Gage R&R <10 percent), program call-up using bar code reader, and an XML file format output for easy integration to shop floor control systems.
EPP EUROPE 451
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