Fico has introduced the ASM-W: a dedicated molding system for multi-array packages (MAP). According to the company the new molding system lowers the manufacturing cost of molding of one-sided packages such as QFN, BGA, BOC and BGA-MAPs by up to 40 percent compared to traditional solutions. The same applies to other demanding packaging applications such as flip chip, multi-chip array and stacked die. The system has been developed around a new machine concept. The molding system realizes the latest technology advances by integrating many innovative construction details, many of them patented to Fico. This applies especially to innovative processes to save on consumables, increase throughput and substantially improve yields. The machine employs top-edge molding, dynamically controlled temperature profiles and vacuum support. ASM-W takes into account that the molding material is one of the most significant factors contributing to total cost in the molding process. With the new system, this problem is now solved by top-edge gating, a patented process owned by Fico. It results in an improved singulation of the molded part, which saves up to 25 % of epoxide material. With this top-edge process, the feeding of the molding material is done over the clamp rail of the top edge so that the distribution channels can nowhere come in contact with the substrate. This eliminates the gold layer, which, in traditional molding presses, can account for up to 20 % of total manufacturing cost.
Stress-free air cushion transport within the machine ensures gentle handling and processing of extremely fine, virtually paper-thin substrates. With this setup, even back-wired substrates (BOC) are processed problem-free. Also, in another substantial process improvement, the transport is carried out over a preheated surface, which saves additional heating time and thereby enlarges throughput. A major factor enabling the increased throughput of the system is dynamic temperature control (DTC). Since the material within the molding channel has a longer curing time than in the formed part, the molding channel is heated to a significantly higher temperature. This causes the material inside the channel to cure in the same time as in the final part.
Especially thin parts extending over a large-area tend to waviness during the enveloping step. This may complicate their processing. Controlled temperature step-down under pressure now yields parts of extreme planarity upon leaving the ASM-W, which makes it much easier to further process them. Finally, active air release enables multi-chip modules (MCM), stacked die and flip chips with underfill to be evenly and securely enveloped with a large process window. The molding system dynamically controls the pressure in the forming cavity as a function of the transfer position by means of cavity vacuum control (CVC). With these performance features, Fico’s AMS-W is able to mold the most complex array products in a cost-efficient and reliable way.
EPP Europe 429
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