Homepage » Technology » Applications »

Modular platform with throughput of 95,000 cph

Applications
Modular platform with throughput of 95,000 cph

Modular platform with throughput of 95,000 cph
The modular direct drive mounter GXH-3 with maximized throughput from Hitachi High-Technologies Europe GmbH is capable of placing components at ultra high-speed and handling odd shape parts. Beside of the throughput of 95,000 cph the GXH-3 has been improved in comparison to the current type GXH-1S in regard to operability, prevention of operation errors, easier handling and visibility. At the same time optimized modular expansion GXH-3J is introduced. While GXH-3 is offering 4 gantries (see image), the GXH-3J is equipped with 2 gantries. The modular concept of the GXH-platform allows defining for each production line the best configuration, for example, with 2 gantries (GXH-3J), with 4 gantries (GXH-3) or with 6 gantries (GXH-3 plus GXH-3J). The GXH-3J can be used to increase the component-handling spectrum, to increase the production throughput and to optimally expand the existing production capability according to the demand. The direct drive modular system places chips on PCBs at a theoretical throughput of 95,000 cph (GXH-3J: 47,500 cph) using “direct drive head technology”. The machine is suitable for a wide range of component types. This placement system can be equipped with high-speed heads to place components from 01005 to 44 x 44 mm and components height of 12.7 mm, or alternatively, with multifunctional heads, which allow handling of components up to 55 x 55 mm and a height of 25,4 mm. Possible component packages are QFP/BGA, CSP, odd shape components and connectors up to 100 x 26 mm. As a result of the interchangeable and modular concept, it is also possible to combine high-speed heads with multifunctional heads in one machine. The mounter offers 4 gantries, each with one placement head. Each of the 4 heads is equipped with 12 nozzles. The XY-axes have linear motor drive, which allows high-speed and high-accuracy positioning. The enterprise achieves high placement accuracy by using its well-proven line sensor, which not only checks the presence of the component on the nozzle, but is also feeding back to the Z-axis for optimum placement descent. This placement system offers one-shot recognition of 12 components on the fly. Furthermore the mounter can handle boards up to 460 x 460 mm (optionally 610 x 460 mm) and allows loading of maximum 200 component types in 8 mm dual tape feeders (GXH-3J: 100 component types). The intelligent electronic feeder system allows full component traceability. Changeover is quickly done by use of a bank feeder change cart. Tape splicing can be done without stopping the machine.

GXH-3 and GXH-3J are ideally qualified for both low volume batch production with a wide variety of components, and for mass production.
Productronica, Stand A5.358
EPP Europe 445
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2024
READ
Newsletter

Subscribe to our newsletter now

Webinars & Webcasts

First hand technical knowledge

Whitepapers

Find all current Whitepapers here

Videos

Find all current videos here


Industrie.de Infoservice
Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:














Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.
AGB
datenschutz-online@konradin.de