For its compact selective soldering and desoldering stations SSM 4A and SSM 9, Zevac has launched a module for preheating of printed circuit boards before the lead-free selective soldering process.
The copper separation on printed circuit boards is substantially reduced by the shortened contact time with the solder. The preheater PH4 with an IR radiation area of 300 x 300 mm is a stand-alone unit and can be operated with any SSM 4A or SSM 9. With a power consumption of 3500 W, the preheater module also has enough heating power to preheat bulky printed circuit boards to the desired temperature.
The board is moved manually over the preheater by means of the board support. A previously mounted thermocouple measures the surface temperature. When reaching the programmed temperature, an audible signal is sounded. The operator can then move the board over the selective soldering machine and start the selective soldering process.
EPP Europe 415
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