The Essemtec WS330 is a compact wave-soldering machine for small-to-mid-size volumes in Pb-containing and lead-free technology. The soldering width of up to 330mm and the universal pallet transport system allows users to work with a large variety of boards. The oven features a dual-wave technology, allowing THTs and SMDs to be processed. Full-convection preheating, spray fluxing and composite-coated parts allow the machine to run with low maintenance cost. The preheating chamber allows for small delta-T values, precise hot-air flow and closed-loop operation. The high temperature efficiency enables a shorter preheat zone than with IR technique. The coating of solder pot and wave-guiding elements eliminates possible problems. All parts in contact with the solder are coated (pot, pump, channel). The machine is available with spray or foam fluxer. It is equipped with a universal palette-transportation mechanism featuring an antistatic belt.
EPP EUROPE 421
Share:
