No clean, low residue and halide free, Almit Technology’s flux technology has been optimized to deliver a high performance with both lead-free and conventional tin-lead solders. Ideally suited to re-working or post mass soldering applications, SR-7 is an easy-to-use rosin-free material designed to deliver excellent soldering on all commonly used printed circuit board finishes, from lead-free HASL to immersion silver, tin ENIG and OSP. An inherent low solids content ensures that the minimal post soldering residues are non-sticky, thereby allowing for more efficient and unhindered probe testing. Meanwhile, complete compliance with Bellcore SIR guarantees manufacturers a reliable soldering performance. The general purpose liquid flux is fully compatible with all the company-owned solder pastes and cored wires. It is available in five litre and one litre plastic containers, as well as in pen format.
EPP Europe 410
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