Cookson Electronics Assembly Materials has announced the launch of its Alpha OM-338 PT lead-free no-clean solder paste. This new product is said to offer unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield. “Lead-free pastes have an inherent difficulty with pin test yields. Thanks to our global market intelligence gathering, and world class team of product formulators, OM-338 PT has proven to be a very promising innovation,” said Mitch Holtzer, Cookson Electronics’ Global Product Manager. “The paste is targeted to both EMS and OEM customers using in line circuit testing. OM-338PT was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield.”
The lead-free no-clean solder paste is designed for electronics manufacturers who are currently dissatisfied with their lead-free paste selection, or who have yet to make a decision as the RoHS compliance deadline of July 1, 2006 approaches.
In addition to excellent pin testability with virtually no residue on pins, it offers high print speeds (up to 150 mm/second, on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and excellent low voiding and anti-slumping characteristics.
EPP EUROPE 420
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