Cookson Electronics Assembly Materials’ favored Alpha Vaculoy SACX 0307 lead-free paste is reportedly outperforming SnCuNi alloys, and offers soldering performance equivalent to SAC305 but at some 30% lower costs. The Alpha OM338 lead-free paste will help users simplify the transition to Pb-free thanks to its wide reflow process window and its ultra-fine printing capabilities. The B3 substrate and wafer-bumping technology is said to offer speeds about 100-times faster than traditional plating. It can handle a wide range of different sizes and pitches.
Productronica, Booth 4.262
EPP EUROPE 435
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