The LPKF MicroCut high-speed stencil laser cuts any shape at up to 50,000 apertures per hour, making it suitable for high-end wafer-bumping stencil manufacturing. Its advanced cutting speed is accomplished by a specially developed beam deflection system that operates more dynamically and precisely than typical XY-tables. With an effective material focus diameter of 20µm, the tool is said to be exceptionally accurate and can produce sharp contours with tiny radii of up to 10µm. The stencil laser features proprietary PulseShape technology, which eliminates the heat effect that causes coining or warpage of high-density and thin stencils. The system also incorporates a cutting technology that avoids burrs at exiting edges, so no-post-treatment is necessary. Stencils produced with the MicroCut reportedly exhibit the high quality and manufacturing precision that is required for optimum release characteristics for stencil paste printing.
EPP EUROPE 425
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