The Seho selective soldering machine GoSelective 350 features high flexibility and modular construction and can handle both boards as well as masks. The basic version was designed for stand-alone-operation. Infeed and outfeed of assemblies is made manually using a rotary table. A flexible gripper, which is installed at the gantry takes the assemblies from the table, passes them over the fluxing and soldering unit and deposits the soldered board back in the table. The XY-axes with servomotors provide for a reliable positioning and repeatability of ±0.1 mm. The gripper at the Z-axis and is provided with a pneumatic tilting and rotation function, to assure an exactly defined peel-off resulting in high soldering quality. Moreover, also joints that are difficult to access can be processed with high reliability. The fluxing system, using all formulations with up to 5 % solids, is equipped with a micro-dropjet fluxer, enabling a very precise apply of flux and low contamination. There is a choice of a miniwave soldering or a dip-soldering tool. A variety of quickly exchangeable single nozzles, which may be used for both, dip soldering and drag soldering, is available. Short cycle times are achieved with product-specific dip soldering multi-nozzle tools. The solder wave is permanently controlled to guarantee a reliable and reproducible process, also for lead-free applications. Teaching solder joints is easy: a laserpointer in the Y-axis allows the designation of the positions. The software then automatically generates default values for soldering direction, angle, time and speed.
EPP EUROPE 432
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